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Thermal Conductive Firm
Silicone-free thermal adhesive film offering strong bonding, electrical insulation, flexibility, and easy die-cut processing.

Key Features
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High thermal conductivity
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High electrical insulation
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Easy die cutting and handling
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Excellent flexibility
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Free of silicones
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Halogen free
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Flame retardant
Applications
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Smart terminals, smartphones, tablets
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Communication equipment
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Power modules
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High-power LEDs, power semiconductors
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EV, automotive electronics
Structure

​Specifications

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