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Thermal Conductive Firm

Silicone-free thermal adhesive film offering strong bonding, electrical insulation, flexibility, and easy die-cut processing.

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Key Features

  • High thermal conductivity

  • High electrical insulation

  • Easy die cutting and handling

  • Excellent flexibility

  • Free of silicones

  • Halogen free

  • Flame retardant

Applications

  • Smart terminals, smartphones, tablets

  • Communication equipment

  • Power modules

  • High-power LEDs, power semiconductors

  • EV, automotive electronics

Structure

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​Specifications

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